Duke
16.08.2007, 16:18
Stutensee, 15.Aug. 2007 : MSC german manufacturer of high end electronics and memory modules today launches their DDR3-lineup under the CellShock brand which will be available immediately.
CS3222580 DDR3 1800Mhz 8-7-6-21 2GB Dual Channel Kit
CS3222270 DDR3 1600Mhz 7-6-6-18 2GB Dual Channel Kit
Based on the much sought after Micron DDR3 ICs and binned to aggressive 7-6-6-18 (1600) and 8-7-6-21 (1800) timings both products represent the lowest latency 1600 and 1800 Kits available on the market. This was possible due to Cellshocks
advanced binning process and an ultra low noise PCB optimized for Micron DDR3 ICs.
The new DDR3-products from CellShock are designed for performance-hungry enthusiasts eager to upgrade to the latest memory technology and aiming for maximum performance in games, demanding applications and benchmarks.
Specification of the new CellShock DDR3-products:
Part #: CS3222270
Capacity: 2GB-Kit (2x1GB)
Config: 128Mx64
DRAM: Micron
Device Config: 128Mx8
PCB: 240pin
Module Info: unbuffered, Non-ECC, DDR3 DIMM
Speed: PC12800
Cas Latency: 7-6-6-18
VDIMM: 1,7V 1,9V
Warranty: 5 years
Part #: CS3222580
Capacity: 2GB-Kit (2x1GB)
Config: 128Mx8
DRAM: Micron
Device Config: 128Mx8
PCB: 240pin
Module Info: unbuffered, Non-ECC, DDR3 DIMM
Speed: PC14400
Cas Latency: 8-7-6-21
VDIMM : 1,7V 1,9V
Warranty: 5 years
CS3222270 (SRP 439 incl. tax) and CS3222580 (SRP 499 incl. tax) are available now.
CS3222580 DDR3 1800Mhz 8-7-6-21 2GB Dual Channel Kit
CS3222270 DDR3 1600Mhz 7-6-6-18 2GB Dual Channel Kit
Based on the much sought after Micron DDR3 ICs and binned to aggressive 7-6-6-18 (1600) and 8-7-6-21 (1800) timings both products represent the lowest latency 1600 and 1800 Kits available on the market. This was possible due to Cellshocks
advanced binning process and an ultra low noise PCB optimized for Micron DDR3 ICs.
The new DDR3-products from CellShock are designed for performance-hungry enthusiasts eager to upgrade to the latest memory technology and aiming for maximum performance in games, demanding applications and benchmarks.
Specification of the new CellShock DDR3-products:
Part #: CS3222270
Capacity: 2GB-Kit (2x1GB)
Config: 128Mx64
DRAM: Micron
Device Config: 128Mx8
PCB: 240pin
Module Info: unbuffered, Non-ECC, DDR3 DIMM
Speed: PC12800
Cas Latency: 7-6-6-18
VDIMM: 1,7V 1,9V
Warranty: 5 years
Part #: CS3222580
Capacity: 2GB-Kit (2x1GB)
Config: 128Mx8
DRAM: Micron
Device Config: 128Mx8
PCB: 240pin
Module Info: unbuffered, Non-ECC, DDR3 DIMM
Speed: PC14400
Cas Latency: 8-7-6-21
VDIMM : 1,7V 1,9V
Warranty: 5 years
CS3222270 (SRP 439 incl. tax) and CS3222580 (SRP 499 incl. tax) are available now.